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Pressure application device Product List

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Pressure-type adhesive application device "Bonding Machine"

Uniformly attach the work to the attachment plate.

The bonding machine (water-cooled type) is designed for the attachment work of fixing workpieces to the bonding plate using wax, among other tasks. It enables good adhesion through a pressurized air press. By combining it with a water cooling unit, further efficiency can be achieved. <Product Lineup> - Compatible with bonding plates from 12 inches to 24 inches - Number of processing axes: 1 to 4 axes *Other sizes and number of axes can be accommodated separately.

  • LED Module
  • Pressure application device

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